ST launches highly miniaturized 4G smartphone antenna common chip

21ic News STMicroelectronics (ST) launched a highly miniaturized 4G smartphone antenna common chip, which makes the phone look slimmer and has higher GPS navigation performance.

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In terms of design, 4G smartphones must use multiple cellular connections to provide mobile broadband services above 100 Mbps. The smartphone has built-in Bluetooth, Wi-Fi and GPS communication modules. These RF modules must share the same antenna to save space on the mobile phone board. STMicroelectronics has developed a miniature antenna sharing chip with a size of only 1.14 mm2 using advanced packaging technology. This DIP1524 antenna sharing chip can simultaneously provide high-intensity signals for several RF receivers.

Because the GPS satellite signals received by mobile phones are usually weak, efficient antenna connection performance is especially important for GPS mobile phones. The built-in DIP1524 smart phone will bring extraordinary experience to users, for example, shorter GPS startup time (first positioning time). Higher positioning accuracy and, in addition to benefiting from the connection of multiple satellites, the quality of the positioning service is more reliable.

DIP1524 uses ST's Integrated Passive Device (IPD) to fabricate on a glass substrate with a lower insertion loss than other brands of ceramic substrates. The flip-chip package has a footprint that is comparable to the size of the die itself, while similar products in the same package have a footprint of more than 3 mm2, so the new product saves 65% of the printed circuit board space. The DIP1524 allows handset design engineers to connect Bluetooth, Wi-Fi and LTE band 7 to the same antenna.

Main features of DIP1524:
• GPS insertion loss: 0.65 dB (max)
• GLONASS insertion loss: 0.75 dB (max)
• Zero performance drift • High channel isolation • No numerical dispersion between devices

The DIP1524-01D3 sample is available in a 4-bump flip-chip package and will be in volume production.